ET815 SPECIFICATIONS

CPU
Mobile Intel^® Pentium^® III processor-M Intel^®
Celeron^® processor

CPU Front Side Bus
66/100/133MHz

Chipset
Intel^® 815E Chipset
GMCH: 82815 (544-pin BGA)
ICH2: 82801BA (360-pin BGA)
FWH: 82802AA(4Mb)

BIOS
Award 2Mbit Flash BIOS

System Memory
One SODIMM socket
Supports to 256MB* PC/100/133 SODIMM modules
* Certain 512MB DIMM modules are supported.

IDE Interface (on base board)
One enhanced IDE interface supports 2 IDE devices in UDMA/33/66/100, PIO mode 4 and bus master Mode

LPC I/O
Winbond 83627 for IrDA interface, parallel port, COM ports, FDC, and har

Parallel Port (on base board)
One parallel port supports SPP/EPP/ECP

Serial Ports (on base board)
Two RS-232 ports

PCI to ISA Bridge
Winbond 83628 + 83629

ETX Interface
Four connectors for PCI-bus, USB, Audio, VGA, LCD, COM1, COM2, LPT, Floppy, IrDA, Mouse, Keyboard, IDE1, IDE2, Ethernet, ISA

Built-in VGA Function
SMI721G4, 4MB VGA memory
One channel 18-bit LVDS

Built-in Audio Function
ICH2 Built-in audio
With AC97 Codec STAC9721
Connectors for Line-out, Line-in, Microphone

Ethernet Function
Built in Intel^® 82801 with Intel^® 82562E PHY
One channel 18-bit LVDS

Form Factor
ETX form factor

Dimensions
100mm x 114mm (3.98" x 4.49")

Power Requirement
+5V: 5A (for ET815-400, ET815-500)

ENVIRONMENTAL FACTORS

Operating Temperature
0?C~60?C (32?F~140?F)

Storage Temperature
-20?C~80?C (-68?F~176?F)

Relative Humidity
10%~90% (non-condensing)

ORDERING INFORMATION

ET815-700 - Mobile Intel^® Pentium^® III Processor-M 850MHz* / SMI 722, 8MB embededded

IP100	- 5.25-inch Disk-Size ETX Base Board
IP300	- 3.25" base board with ETX interface